Probe heads optimized for wafer-level chip-scale package testing

December 05, 2017 // By Julien Happich
Smiths Interconnect has launched the Volta Series probe heads, optimized for wafer-level chip-scale package testing.

Volta is used for testing the chips (while in their wafer form) that are behind everything from Bluetooth and power management to digital display controllers. The new probe head are the result of Smiths Interconnect’s close collaboration with customers, and has been designed to significantly outperform the competition in durability and reliability. It uses innovative, world-class electrical contact technologies and proprietary-engineered materials to achieve improved performance and production efficiency.

In the Volta Series spring probe contacts are used in place of cantilever and traditional vertical probe card technologies. The design itself ensures an extremely short signal path enabling low and stable contact resistance, high current carrying capacity and longer life cycle. Proprietary-engineered plastic and machined ceramic materials used in the product make for improved planarity that allows increased test parallelism. The housing allows for easy maintenance, quick installation and field repair potential that all add up to reduced cost of ownership. The state-of-the-art Volta Manual Actuator (Lid) design allows sorted die tests at all sites simultaneously as well as eliminates the possibility of die cracking even after repetitive tests, enabling probe card bring-ups prior to the wafer availability.

Smiths Interconnect - www.smithsinterconnect.com