The ultra-miniature relay (9.4 mm diameter x 8.64 mm high) weighs 2.55g and provides improved high frequency performance with reduced signal degradation, the distributor comments. The SGRF300 series relays are used in Automatic Test Equipment (ATE) where the parameters of the Device Under Test (DUT) are being measured and high repeatability combined with high frequency signal fidelity is important. In applications such as semiconductor testing where the relay can be switching with high frequency, insertion loss repeatability over the life of the relay is essential. The SGRF300 series provides leading insertion loss repeatability over the 10 million cycle life of the relay when switching low level RF signals to 18 Gbps. Its ground shield design ensures isolation and improved high frequency performance whilst enabling visual inspection of the surface mount solder connections.
SGRF300 series relays, the distributor adds, extend performance advantages over similar RF devices with simple formed surface out leads making them useful for RF attenuators, RF Switch Matrices and other applications such as broadcast and aerospace where high frequency signal fidelity and performance are required. To keep signal lines separate to avoid the signal on one line interfering or affecting the signal on another lead, there is a ground shield between each lead.